Roadmap
2007 to 2013
Core IP developed and patented
• ReRAM building blocks in place
• Proof of concept in affordable geometries - basic memory cell works well
• Patented Interface Switching ReRAM memory cell based on oxygen vacancies
2014
Strategic Partnership Established
• Joint Development Agreement established with HGST, a Western Digital subsidiary
• Enables scaling to the geometries that matter for high-density Storage Class Memory
• Enables 4DS to prove the value of its IP in a cost-effective way
2015
Scalable ReRAM cells developed
• Public Offer closes oversubscribed
• Developed functional cells smaller than 250nm with high yield and lot-to-lot consistency
• JDA with HGST renewed in July 2015
• A$2.75 million raised
2016
ReRAM cells scaled to 40nm
• Demonstrated scalability to 40nm which is essential for high-density Storage Class Memory
• JDA with HGST renewed in July 2016
• Successfully met the endurance milestone as defined under the 2015 prospectus
• A$4.0 million raised
2017
Speed breakthrough
• Achieved DRAM-like read speed without the need for speed-crippling error correction
• JDA with HGST renewed in July 2017
• Entered into a collaboration agreement with imec
• A$3.45 million raised
2018
Continues to refine technology with partners
• Investor briefings with Jim Dorrian
• JDA with HGST renewed in May 2018
• Granted 20th USA patent
• USA Marketing Roadshow
• Completes A$3.15 million Placement
2019
Significant progress with imec
• Achieved significant endurance and retention characteristics with imec
• JDA with HGST renewed for 6th consecutive year
• Additional significant achievements with imec for a second time
• Completes A$3.25 million Placement and A$0.75 million SPP
• Granted 21st and 22nd USA patents
• 4DS progresses to imec's memory megabit platform
• Extends collaboration with imec to 2020
2020
Best Data
Results To Date
• Progresses to imec platform
• Extends imec collaboration
• Granted 23rd 24th 25th 26th 27th 28th and 29th USA patents
• HGST renew for 7th consecutive year
• Most successful data to date
• Raises A$7.6 million
• Drs Willibrordus (Wilbert) van den Hoek appointed Non-Executive Chairman
2021
Key Highlights
To Date
• Positive results from Non-Platform Lot
• Commence production of Platform Lot at imec
• Granted 30th USA Patent
• Admitted to the S&P/ASX All Technology Index
• Granted 31st and 32nd USA Patent
• Technical Update
• Renewed imec agreement for 2022
• $AUD 6 million raised from Placement and Share Purchase Plan
2022
Key Highlights
To Date
• Testing upgrade and management changes
• Appointment of new CEO and Managing Director
• HGST renews for 9th consecutive year
• Company update re Third Platform Lot, Management changes and strategic review of results
• Extension of imec collaboration for 2023
2023
Key Highlights
To Date
• Renewed Technical Progress Update
• Granted 34th USA Patent
• Placement for $5.5 Million Completed
Next Steps – Demonstrate a megabit memory in a production-compatible process
• Develop a production-compatible process for the 4DS Interface Switching ReRAM technology in collaboration with imec using the same state-of-the-art process equipment currently in use by high-density high-volume memory makers.
• Demonstrate this production-compatible process with imec’s proven memory platform to build a 4DS megabit memory.
• Collect statistical significant data for yield, speed, endurance and retention at the megabit chip level that high-density high-volume memory makers & buyers need know to make informed decisions.