Roadmap

2007 to 2013

Core IP developed and patented

• ReRAM building blocks in place

• Proof of concept in affordable geometries - basic memory cell works well

• Patented Interface Switching ReRAM memory cell based on oxygen vacancies

2014

Strategic Partnership Established

• Joint Development Agreement established with HGST, a Western Digital subsidiary

• Enables scaling to the geometries that matter for high-density Storage Class Memory

• Enables 4DS to prove the value of its IP in a cost-effective way

2015

Scalable ReRAM cells developed

• Public Offer closes oversubscribed

• Developed functional cells smaller than 250nm with high yield and lot-to-lot consistency

• JDA with HGST renewed in July 2015

• A$2.75 million raised

2016

ReRAM cells scaled to 40nm

• Demonstrated scalability to 40nm which is essential for high-density Storage Class Memory

• JDA with HGST renewed in July 2016

• Successfully met the endurance milestone as defined under the 2015 prospectus

• A$4.0 million raised

2017

Speed breakthrough

• Achieved DRAM-like read speed without the need for speed-crippling error correction

• JDA with HGST renewed in July 2017

• Entered into a collaboration agreement with imec

• A$3.45 million raised

2018

Continues to refine technology with partners


• Investor briefings with Jim Dorrian

• JDA with HGST renewed in May 2018

• Granted 20th USA patent

• USA Marketing Roadshow

• Completes A$3.15 million Placement

2019

Significant progress with imec

• Achieved significant endurance and retention characteristics with imec

• JDA with HGST renewed for 6th consecutive year

• Additional significant achievements with imec for a second time

• Completes A$3.25 million Placement and A$0.75 million SPP

• Granted 21st and 22nd USA patents

• 4DS progresses to imec's memory megabit platform

• Extends collaboration with imec to 2020

2020

Best Data

Results To Date

• Progresses to imec platform

• Extends imec collaboration

• Granted 23rd 24th 25th 26th 27th 28th and 29th USA patents

• HGST renew for 7th consecutive year

• Most successful data to date

• Raises A$7.6 million

• Drs Willibrordus (Wilbert) van den Hoek appointed Non-Executive Chairman

2021

Key Highlights

To Date

• Positive results from Non-Platform Lot

• Commence production of Platform Lot at imec

• Granted 30th USA Patent

• Admitted to the S&P/ASX All Technology Index

• Granted 31st and 32nd USA Patent

• Technical Update

• Renewed imec agreement for 2022

• $AUD 6 million raised from Placement and Share Purchase Plan

2022

Key Highlights

To Date

• Testing upgrade and management changes

• Appointment of new CEO and Managing Director

• HGST renews for 9th consecutive year

• Company update re Third Platform Lot, Management changes and strategic review of results

• Extension of imec collaboration for 2023

2023

Key Highlights

To Date

• Renewed Technical Progress Update

• Granted 34th USA Patent

• Placement for $5.5 Million Completed

Next Steps – Demonstrate a megabit memory in a production-compatible process

• Develop a production-compatible process for the 4DS Interface Switching ReRAM technology in collaboration with imec using the same state-of-the-art process equipment currently in use by high-density high-volume memory makers.

• Demonstrate this production-compatible process with imec’s proven memory platform to build a 4DS megabit memory.

• Collect statistical significant data for yield, speed, endurance and retention at the megabit chip level that high-density high-volume memory makers & buyers need know to make informed decisions.